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Influence of Prestressed Layer on Crack Deviation in 1030 nm Femtosecond Laser Marking of Tempered Glass

In the realm of precision marking, the use of the 1030 nm femtosecond laser marking machine has become increasingly prevalent for its ability to engrave intricate details on a variety of materials, including tempered glass. This article delves into the impact of the prestressed layer inherent in tempered glass on the crack deviation during the laser marking process.

Tempered glass, known for its increased strength compared to regular glass, is manufactured through a process of thermal tempering that induces compressive stress on the surface and tensile stress in the center. This prestressed layer plays a crucial role in the glass's resistance to breakage. However, when subjected to a 1030 nm femtosecond laser marking machine, the interaction between the high-intensity laser pulses and the prestressed layer can lead to complex outcomes.

The femtosecond laser marking machine operates on the principle of nonlinear absorption, where the ultra-short pulse duration allows for the selective ablation of material without causing significant heat-affected zones. In the context of tempered glass, this precision is paramount to avoid compromising the structural integrity.

When the 1030 nm femtosecond laser interacts with the prestressed layer of tempered glass, several phenomena occur. The high peak power of the femtosecond pulses can cause local ionization, leading to micro-explosions that remove material and create the desired mark. However, the presence of prestress can influence how these cracks propagate.

The prestressed layer can either act as a guide for the裂纹, causing them to follow the direction of maximum tensile stress, or it can deflect the裂纹, altering their path from the intended marking design. This deviation can result in marks that are less precise or even completely missed, compromising the quality and functionality of the marking.

To assess the influence of the prestressed layer on crack deviation, a series of experiments can be conducted using the 1030 nm femtosecond laser marking machine. By varying the laser parameters such as pulse energy, repetition rate, and scanning speed, and monitoring the resulting marks, a quantitative relationship between the prestress and crack deviation can be established.

It is hypothesized that higher prestress levels would result in a greater deviation from the intended marking path. This hypothesis can be tested by comparing the marking outcomes on tempered glasses with varying levels of prestress. The results can provide valuable insights for optimizing the laser marking parameters to achieve the desired marking quality on tempered glass.

In conclusion, the prestressed layer in tempered glass significantly influences the crack deviation during the 1030 nm femtosecond laser marking process. Understanding and controlling this interaction are essential for achieving high-quality and precise markings on tempered glass. Further research and optimization using the femtosecond laser marking machine can lead to improved marking techniques that leverage the unique properties of tempered glass.

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